UNCC Dual Domain Analysis Technology and the 3D Analysis Technology Questions
Question Description
The homework question is:
” In this homework, we will use Autodesk MoldflowTM to conduct analysis for finding out the injection location and perform fill and pack analysis. Please find the adapter.stl file that has been located in the Announcement section on the Blackboard. Download it and using the analysis conducted by Autodesk MoldflowTM, answer the following questions”
I have attached the homework question and the adapter.stl file as link
https://drive.google.com/file/d/1-HmOLhjxJZsj296N-z0pJ4wSkiIFvxui/view?usp=sharing.
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